Dehong Ye

Title: Dehong Ye: Innovator in Semiconductor Technology

Introduction

Dehong Ye is a prominent inventor based in Tianjin, China, known for his significant contributions to semiconductor technology. With a total of seven patents to his name, he has made remarkable advancements in the field of integrated circuit devices.

Latest Patents

One of his latest patents is a method of fabricating a 3-dimensional fan-out structure. This innovative method involves providing a substrate carrier with an aperture and bonding a semiconductor die to the first surface of the carrier. The encapsulant and a second die are then deposited within the aperture, ensuring that the active surface of the second die is coplanar with the carrier's second surface. Additionally, one or more redistribution layers are applied to form a 3D fan-out structure. Another notable patent is the die edge seal employing low-K dielectric material. This patent describes a multi-stage structure that dampens nascent cracks during dicing and inhibits moisture penetration into the active region of a die. The structure includes an array of die regions separated by scribe lanes, with a first ring surrounding the active region made of low-k dielectric material.

Career Highlights

Dehong Ye has worked with notable companies in the semiconductor industry, including Freescale Semiconductor, Inc. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor technology.

Collaborations

Throughout his career, Dehong has collaborated with talented individuals such as Zhiwei Gong and Wei Gao. These collaborations have likely fostered an environment of innovation and creativity in their projects.

Conclusion

Dehong Ye's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in integrated circuit devices and semiconductor manufacturing.