The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Apr. 01, 2010
Zhiwei Gong, Chandler, AZ (US);
Nageswara Rao Bonda, Chandler, AZ (US);
Wei Gao, Tianjin, CN;
Jinsheng Wang, Tianjin, CN;
Dehong YE, Tianjin, CN;
Zhiwei Gong, Chandler, AZ (US);
Nageswara Rao Bonda, Chandler, AZ (US);
Wei Gao, Tianjin, CN;
Jinsheng Wang, Tianjin, CN;
Dehong Ye, Tianjin, CN;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method and apparatus are described for fabricating a low-pin-count chip package () including a die pad () for receiving an integrated circuit device and a plurality of connection leads () having recessed lead ends () at the outer peripheral region of each contact lead. After forming the package body () over the integrated circuit device, unplated portions () of the exposed bottom surface of the selectively plated lead frame are partially etched to form recessed lead ends () at the outer peripheral region of each contact lead, and the recessed lead ends are subsequently re-plated () to provide wettable recessed lead ends at the outer peripheral region of each contact lead.