The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Jun. 09, 2006
George R. Leal, Cedar Park, TX (US);
Victor A. Chiriac, Phoenix, AZ (US);
Tien Yu T. Lee, Phoenix, AZ (US);
Marc A. Mangrum, Manchaca, TX (US);
Robert J. Wenzel, Austin, TX (US);
George R. Leal, Cedar Park, TX (US);
Victor A. Chiriac, Phoenix, AZ (US);
Tien Yu T. Lee, Phoenix, AZ (US);
Marc A. Mangrum, Manchaca, TX (US);
Robert J. Wenzel, Austin, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A package assemblyincludes a semiconductor die (e.g., an RF power amplifier)fixed within the cavity of a conductive leadframeusing a thermally and electrically-conductive adhesive material. The semiconductor diehas a first side and a second side, wherein the first side includes at least one active area, and the second side includes at least one contact region. The conductive leadframe (e.g., a copper leadframe)has two planar surfaces and a cavity formed therein. The adhesive materialis configured to couple the semiconductor diewithin the cavity of the conductive leadframesuch that the first side of the semiconductor die is substantially coplanar with the first surface of the conductive leadframe.