Robert Joseph Wenzel

USPTO Granted Patents = 19 (Patent Applications = 4)

Average Co-Inventor Count = 3.0

ph-index = 8

Forward Citations = 707(Granted Patents)

Company Filing History:

15 out of 5,491

Freescale Semiconductor,inc.

Years Active: 2004-2024

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19 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11876059 - Semiconductor device with directing structure and method therefor (2024-01-16),

2. 10256193 - Methods and devices with enhanced grounding and shielding for wire bond structures (2019-04-09),

3. 9974174 - Package to board interconnect structure with built-in reference plane structure (2018-05-15),

4. 9748168 - Substrate with routing (2017-08-29),

5. 8912667 - Packaged integrated circuit using wire bonds (2014-12-16),

6. 8072062 - Circuit device with at least partial packaging and method for forming (2011-12-06),

7. 7892882 - Methods and apparatus for a semiconductor device package with improved thermal performance (2011-02-22),

8. 7834466 - Semiconductor die with die pad pattern (2010-11-16),

9. 7763976 - Integrated circuit module with integrated passive device (2010-07-27),

10. 7674656 - Die positioning for packaged integrated circuits (2010-03-09),

11. 7632715 - Method of packaging semiconductor devices (2009-12-15),

12. 7579219 - Semiconductor device with a protected active die region and method therefor (2009-08-25),

13. 7553753 - Method of forming crack arrest features in embedded device build-up package and package thereof (2009-06-30),

14. 7528069 - Fine pitch interconnect and method of making (2009-05-05),

15. 7405102 - Methods and apparatus for thermal management in a multi-layer embedded chip structure (2008-07-29),

Title: Robert Joseph Wenzel: Innovator in Semiconductor Technology

Introduction

Robert Joseph Wenzel, based in Austin, TX, is a prolific inventor with a total of 19 patents to his name. His work in the semiconductor field has contributed significantly to advancements in device technologies, enhancing both performance and efficiency.

Latest Patents

Among his latest innovations are two notable patents. The first, titled "Semiconductor device with directing structure and method therefor," covers a semiconductor device featuring a radiating element and a directing structure. This device incorporates a package for integration and is designed to efficiently propagate radio frequency (RF) signals through its innovative structure.

The second patent, "Methods and devices with enhanced grounding and shielding for wire bond structures," describes a semiconductor device architecture that includes a package substrate with a semiconductor die. This device is engineered to improve grounding and shielding, ensuring greater reliability and performance in semiconductor applications.

Career Highlights

Throughout his career, Robert has notably contributed to industry leaders such as Freescale Semiconductor, Inc. and NXP USA, Inc. His expertise in semiconductor technologies has made significant impacts on the companies he has worked with, underscoring his role as a leader in innovation.

Collaborations

Robert has worked alongside talented colleagues, including George R. Leal and Jie-Hua Zhao. These collaborations have fostered a creative environment conducive to technological breakthroughs in the semiconductor industry.

Conclusion

Robert Joseph Wenzel continues to be a driving force behind innovations in semiconductor technology. With his substantial patent portfolio and collaborative efforts, he remains an influential figure in the advancement of electronic devices and their applications.

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4 patents pending:

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