The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Jan. 05, 2007
Kevin J. Hess, St. Ismier, FR;
Chu-chung Lee, Round Rock, TX (US);
Robert J. Wenzel, Austin, TX (US);
Kevin J. Hess, St. Ismier, FR;
Chu-Chung Lee, Round Rock, TX (US);
Robert J. Wenzel, Austin, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of packaging a semiconductor includes providing a support structure. An adhesive layer is formed overlying the support structure and is in contact with the support structure. A plurality of semiconductor die is placed on the adhesive layer. The semiconductor die are laterally separated from each other and have electrical contacts that are in contact with the adhesive layer. A layer of encapsulating material is formed overlying and between the plurality of semiconductor die and has a distribution of filler material. A concentration of the filler material is increased in all areas laterally adjacent each of the plurality of semiconductor die.