The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Nov. 29, 2017
Nxp Usa, Inc., Austin, TX (US);
James S. Golab, Austin, TX (US);
Robert Joseph Wenzel, Austin, TX (US);
Stanley Andrew Cejka, Austin, TX (US);
NXP USA, Inc., Austin, TX (US);
Abstract
A semiconductor device includes a package substrate, a semiconductor die attached to a first major surface of the package substrate, and a plurality of wire bonds attached between the semiconductor die and the first major surface of the package substrate. The device further includes a conductive plate over the semiconductor die, plurality of wire bonds, and package substrate wherein a first major surface of the conductive plate faces the first major surface of the package substrate. The device further includes a plurality of conductive extensions attached to the first major surface of the conductive plate, wherein each conductive extension extends from the first major surface of the conductive plate and between two adjacent wire bonds of the plurality of wire bonds.