Company Filing History:
Years Active: 1986-2020
Title: James S Golab: Innovator in Semiconductor Technology
Introduction
James S Golab is a prominent inventor based in Austin, TX (US), known for his significant contributions to semiconductor technology. He holds a total of 10 patents, showcasing his innovative spirit and technical expertise in the field.
Latest Patents
One of his latest patents is titled "Substrate dielectric crack prevention using interleaved metal plane." This invention provides embodiments of a substrate that include a first and second metal plane in a first metal layer, laterally separated by a gap of dielectric material. Additionally, it features a third and fourth metal plane in a second metal layer, vertically adjacent to the first metal layer, with specific configurations to enhance performance. Another notable patent is "Methods and devices with enhanced grounding and shielding for wire bond structures." This patent describes a semiconductor device that includes a package substrate and a semiconductor die, along with a conductive plate and extensions that improve the grounding and shielding of wire bond structures.
Career Highlights
Throughout his career, James has worked with notable companies such as Motorola Corporation and NXP USA, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.
Collaborations
James has collaborated with talented individuals in the field, including Stanley Andrew Cejka and Tingdong Zhou. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
James S Golab is a distinguished inventor whose work in semiconductor technology has made a lasting impact. His patents reflect his commitment to innovation and excellence in the industry.