This inventor holds 3 USPTO granted patents. Top assignee: Nxp USA, Inc.. Active years: 2018-2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018-2020
Title: Innovations of Stanley Andrew Cejka
Introduction
Stanley Andrew Cejka is an accomplished inventor based in Austin, TX (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of electronic devices.
Latest Patents
Cejka's latest patents include innovative solutions for substrate dielectric crack prevention and methods for enhanced grounding and shielding in wire bond structures. The first patent describes a substrate that incorporates multiple metal planes separated by dielectric material gaps, designed to prevent cracks. The second patent outlines a semiconductor device that features a conductive plate and conductive extensions to improve the reliability of wire bonds.
Career Highlights
Cejka is currently employed at NXP USA, Inc., where he continues to develop cutting-edge technologies. His expertise in semiconductor design and manufacturing has positioned him as a valuable asset in the industry.
Collaborations
Throughout his career, Cejka has collaborated with notable colleagues, including James S. Golab and Tingdong Zhou. These partnerships have contributed to the advancement of various projects and innovations in semiconductor technology.
Conclusion
Stanley Andrew Cejka's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the development of reliable electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile