The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
May. 17, 2021
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Robert Joseph Wenzel, Austin, TX (US);
Michael B. Vincent, Chandler, AZ (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01); G01S 13/931 (2020.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01Q 1/2283 (2013.01); G01S 13/931 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/73204 (2013.01);
Abstract
A semiconductor device having a radiating element and a directing structure is provided. The semiconductor device includes a device package. A semiconductor die is coupled to the radiating element integrated in the device package. The directing structure is affixed to the device package by way of an adhesive. The directing structure is located over the radiating element and configured for propagation of radio frequency (RF) signals.