The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Jun. 09, 2006
Tien Yu T. Lee, Phoenix, AZ (US);
Craig S. Amrine, Tempe, AZ (US);
Victor A. Chiriac, Phoenix, AZ (US);
Lizabeth Ann Keser, Chandler, AZ (US);
George R. Leal, Cedar Park, TX (US);
Robert J. Wenzel, Austin, TX (US);
Tien Yu T. Lee, Phoenix, AZ (US);
Craig S. Amrine, Tempe, AZ (US);
Victor A. Chiriac, Phoenix, AZ (US);
Lizabeth Ann Keser, Chandler, AZ (US);
George R. Leal, Cedar Park, TX (US);
Robert J. Wenzel, Austin, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A multi-layer structure () includes a first build-up layer structure () configured to connect to a heat-generating module (), a second build-up layer structure () configured to connect to a substrate, and a middle layer () provided between the first build-up layer structure and the second build-up layer structure, the middle layer including at least one semiconductor component () and a heat spreader (). A first set of thermal vias () extend through the first build-up layer structure to the heat spreader, and a second set of thermal vias (extend through the second build-up layer structure to the heat spreader, wherein at least a portion of the first set of thermal vias is in thermal contact with the heat-generating module.