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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9640469 B1

PDFFull Text
Date of Patent:
May. 02, 2017

Filed:

Sep. 10, 2015

Matrix lid heatspreader for flip chip package

Applicants:

George R. Leal, Cedar Park, TX (US);

Tim V. Pham, Austin, TX (US);

Inventors:

George R. Leal, Cedar Park, TX (US);

Tim V. Pham, Austin, TX (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:

Reema Patel

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 23/433 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/4334 (2013.01); H01L 23/49541 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 21/566 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/141 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/17738 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array () designed for direct attachment to an array of integrated circuit die () by including a thermal interface adhesion layer () to each die () and encapsulating the attached heat spreader lid array () and array of integrated circuit die () with mold compound () except for planar upper lid surfaces of the heat spreader lids ().

Find Patent Forward Citations

Leal, George. (2017). Matrix lid heatspreader for flip chip package (U.S. Patent No. 9640469). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9640469

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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