The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Sep. 10, 2015
Applicants:
George R. Leal, Cedar Park, TX (US);
Tim V. Pham, Austin, TX (US);
Inventors:
George R. Leal, Cedar Park, TX (US);
Tim V. Pham, Austin, TX (US);
Assignee:
NXP USA, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 23/433 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/4334 (2013.01); H01L 23/49541 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 21/566 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/141 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/17738 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/181 (2013.01);
Abstract
A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array () designed for direct attachment to an array of integrated circuit die () by including a thermal interface adhesion layer () to each die () and encapsulating the attached heat spreader lid array () and array of integrated circuit die () with mold compound () except for planar upper lid surfaces of the heat spreader lids ().