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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9099475 B1

PDFFull Text
Date of Patent:
Aug. 04, 2015

Filed:

Sep. 12, 2012

Techniques for reducing inductance in through-die vias of an electronic assembly

Applicants:

Michael B. Mcshane, Austin, TX (US);

Kevin J. Hess, Austin, TX (US);

Perry H. Pelley, Austin, TX (US);

Tab A. Stephens, Austin, TX (US);

Inventors:

Michael B. McShane, Austin, TX (US);

Kevin J. Hess, Austin, TX (US);

Perry H. Pelley, Austin, TX (US);

Tab A. Stephens, Austin, TX (US);

Assignee:

Freescale Semiconductor, Inc., Austin, TX (US);

Attorney:

Yedell Isidore PLLC

Primary Examiner:

Courtney Smith

Assistant Examiner:

Zhengfu Feng

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 7/00 (2006.01); G02B 6/12 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); G11C 5/06 (2006.01); H01L 23/538 (2006.01); H01L 25/04 (2014.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/538 (2013.01); H01L 24/24 (2013.01); H01L 25/04 (2013.01); H01L 25/0657 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32135 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/83 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01);
Abstract

An electronic assembly includes a processor die assembly, a first die assembly, and a second die assembly. The first die assembly is positioned on a first side of the processor die assembly. The second die assembly is positioned on a second side of the processor die assembly opposite the first side of the processor die assembly. Through-die vias couple the first and second die assemblies to the processor die assembly.

Find Patent Forward Citations

McShane, Michael. (2015). Techniques for reducing inductance in through-die vias of an electronic assembly (U.S. Patent No. 9099475). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9099475

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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