The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Sep. 12, 2012
Applicants:
Michael B. Mcshane, Austin, TX (US);
Kevin J. Hess, Austin, TX (US);
Perry H. Pelley, Austin, TX (US);
Tab A. Stephens, Austin, TX (US);
Inventors:
Michael B. McShane, Austin, TX (US);
Kevin J. Hess, Austin, TX (US);
Perry H. Pelley, Austin, TX (US);
Tab A. Stephens, Austin, TX (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 7/00 (2006.01); G02B 6/12 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); G11C 5/06 (2006.01); H01L 23/538 (2006.01); H01L 25/04 (2014.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/538 (2013.01); H01L 24/24 (2013.01); H01L 25/04 (2013.01); H01L 25/0657 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32135 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/83 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01);
Abstract
An electronic assembly includes a processor die assembly, a first die assembly, and a second die assembly. The first die assembly is positioned on a first side of the processor die assembly. The second die assembly is positioned on a second side of the processor die assembly opposite the first side of the processor die assembly. Through-die vias couple the first and second die assemblies to the processor die assembly.