The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2014

Filed:

May. 31, 2012
Applicants:

Michael B. Mcshane, Austin, TX (US);

Kevin J. Hess, Austin, TX (US);

Perry H. Pelley, Austin, TX (US);

Tab A. Stephens, Austin, TX (US);

Inventors:

Michael B. McShane, Austin, TX (US);

Kevin J. Hess, Austin, TX (US);

Perry H. Pelley, Austin, TX (US);

Tab A. Stephens, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device comprises an integrated circuit (IC) die having a top side and a back side. The circuit substrate includes a heat source circuit, a heat sensitive circuit, a package substrate coupled to the top side of the circuit substrate, and a plurality of thermally conductive through-silicon vias (TSVs) formed from the back side of the circuit substrate to near but not through the top side of the circuit substrate.


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