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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9437459 B1

PDFFull Text
Date of Patent:
Sep. 06, 2016

Filed:

May. 01, 2014

Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure

Applicants:

Burton J. Carpenter, Austin, TX (US);

Chu-chung Lee, Round Rock, TX (US);

Tu-anh N. Tran, Austin, TX (US);

Inventors:

Burton J. Carpenter, Austin, TX (US);

Chu-Chung Lee, Round Rock, TX (US);

Tu-Anh N. Tran, Austin, TX (US);

Assignee:

FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);

Attorney:

David G. Dolezal

Primary Examiner:

Mohammad Islam

Assistant Examiner:

Mikka Liu

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/49811 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.

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Quick Actions:

Carpenter, Burton. (2016). Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure (U.S. Patent No. 9437459). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9437459

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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