The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Jan. 31, 2014
Freescale Semiconductor, Inc., Austin, TX (US);
Sheila F. Chopin, Round Rock, TX (US);
Varughese Mathew, Austin, TX (US);
Leo M. Higgins, III, Austin, TX (US);
Chu-Chung Lee, Round Rock, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A mold compound is provided for encapsulating a semiconductor device (). The mold compound comprises at least approximately 70% by weight silica fillers, at least approximately 10% by weight epoxy resin system, and beneficial ions that are beneficial with respect to copper ball bond corrosion. A total level of the beneficial ions in the mold compound is at least approximately 100 ppm.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile