Sheila F Chopin

USPTO Granted Patents = 17 (Patent Applications = 2)

Average Co-Inventor Count = 2.8

ph-index = 5

Forward Citations = 140(Granted Patents)

Location History:

Round Rock, TX (US) (2010 - 2017)
Austin, TX (US) (2006 - 2023)

Company Filing History:

12 out of 5,491

Freescale Semiconductor,inc.

Years Active: 2006-2025

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12415305 - Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes (2025-09-16),

2. 11787097 - Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes (2023-10-17),

3. 10217713 - Semiconductor device attached to an exposed pad (2019-02-26),

4. 10199339 - Semiconductor structure with sacrificial anode and method for forming (2019-02-05),

5. 9640466 - Packaged semiconductor device with a lead frame and method for forming (2017-05-02),

6. 9426884 - System and method for lead frame package degating (2016-08-23),

7. 9412709 - Semiconductor structure with sacrificial anode and passivation layer and method for forming (2016-08-09),

8. 9111952 - Semiconductor device (2015-08-18),

9. 9093383 - Encapsulant for a semiconductor device (2015-07-28),

10. 8955388 - Mold compound compatibility test system and methods thereof (2015-02-17),

11. 8853867 - Encapsulant for a semiconductor device (2014-10-07),

12. 8836110 - Heat spreader for use within a packaged semiconductor device (2014-09-16),

13. 7803662 - Warpage control using a package carrier assembly (2010-09-28),

14. 7215014 - Solderable metal finish for integrated circuit package leads and method for forming (2007-05-08),

15. 7172927 - Warpage control of array packaging (2007-02-06),

Title: The Innovative Journey of Sheila F. Chopin

Introduction

Sheila F. Chopin is a prominent inventor based in Austin, TX, known for her significant contributions to the field of encapsulant compound technology. With a remarkable portfolio of 17 patents, she has made a lasting impact on the industry through her innovative designs and solutions.

Latest Patents

Among her latest patents is the invention of conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes. This encapsulant compound apparatus features a mechanical operator and an insert positioned on the surface of the mechanical operator. The insert is designed to capture foreign material in the encapsulant compound, enhancing the quality and reliability of the encapsulation process.

Career Highlights

Sheila has had a successful career, working with leading companies such as Freescale Semiconductor, Inc. and NXP USA, Inc. Her expertise in encapsulant technology has positioned her as a key player in the development of advanced semiconductor solutions.

Collaborations

Throughout her career, Sheila has collaborated with talented individuals, including Varughese Mathew and Leo M. Higgins, III. These partnerships have fostered innovation and contributed to the successful development of her patented technologies.

Conclusion

Sheila F. Chopin's contributions to the field of encapsulant technology exemplify her dedication to innovation and excellence. Her work

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2 patents pending:

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