Sheila F Chopin

This inventor holds 17 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc.. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheila F Chopin. Retrieved from https://idiyas.com/inventor/sheila-f-chopin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 (Patent Applications = 2)

% Patents Active = 88.2

Average Co-Inventor Count = 2.8

ph-index = 5

Forward Citations = 142(Granted Patents)

Location History:

Round Rock, TX (US) (2010 - 2017)
Austin, TX (US) (2006 - 2023)

Company Filing History:

12 out of 5,491

Freescale Semiconductor,inc.

Years Active: 2006-2025

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Areas of Expertise:

Encapsulant

Lead Frame

Semiconductor Device

Warpage Control

Mold Compound

Solderable Metal Finish

Heat Spreader

Integrated Circuit

Bond Wires

Sacrificial Anode

Thermal Management

Package Carrier

17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12415305 - Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes (2025-09-16),

2. 11787097 - Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes (2023-10-17),

3. 10217713 - Semiconductor device attached to an exposed pad (2019-02-26),

4. 10199339 - Semiconductor structure with sacrificial anode and method for forming (2019-02-05),

5. 9640466 - Packaged semiconductor device with a lead frame and method for forming (2017-05-02),

6. 9426884 - System and method for lead frame package degating (2016-08-23),

7. 9412709 - Semiconductor structure with sacrificial anode and passivation layer and method for forming (2016-08-09),

8. 9111952 - Semiconductor device (2015-08-18),

9. 9093383 - Encapsulant for a semiconductor device (2015-07-28),

10. 8955388 - Mold compound compatibility test system and methods thereof (2015-02-17),

11. 8853867 - Encapsulant for a semiconductor device (2014-10-07),

12. 8836110 - Heat spreader for use within a packaged semiconductor device (2014-09-16),

13. 7803662 - Warpage control using a package carrier assembly (2010-09-28),

14. 7215014 - Solderable metal finish for integrated circuit package leads and method for forming (2007-05-08),

15. 7172927 - Warpage control of array packaging (2007-02-06),

Title: The Innovative Journey of Sheila F. Chopin

Introduction

Sheila F. Chopin is a prominent inventor based in Austin, TX, known for her significant contributions to the field of encapsulant compound technology. With a remarkable portfolio of 17 patents, she has made a lasting impact on the industry through her innovative designs and solutions.

Latest Patents

Among her latest patents is the invention of conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes. This encapsulant compound apparatus features a mechanical operator and an insert positioned on the surface of the mechanical operator. The insert is designed to capture foreign material in the encapsulant compound, enhancing the quality and reliability of the encapsulation process.

Career Highlights

Sheila has had a successful career, working with leading companies such as Freescale Semiconductor, Inc. and NXP USA, Inc. Her expertise in encapsulant technology has positioned her as a key player in the development of advanced semiconductor solutions.

Collaborations

Throughout her career, Sheila has collaborated with talented individuals, including Varughese Mathew and Leo M. Higgins, III. These partnerships have fostered innovation and contributed to the successful development of her patented technologies.

Conclusion

Sheila F. Chopin's contributions to the field of encapsulant technology exemplify her dedication to innovation and excellence. Her work

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: