The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Feb. 24, 2016
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventors:
Varughese Mathew, Austin, TX (US);
Sheila Chopin, Round Rock, TX (US);
Assignee:
NXP USA, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49541 (2013.01);
Abstract
A method of manufacturing a packaged semiconductor device includes patterning and plating silver nanoparticles in bonding areas of a lead frame, forming a hydrophilic group while oxidizing the silver nanoparticles, forming wire bonds on the silver nanoparticles, and encapsulating the wire bonds and the silver nanoparticles.