The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Apr. 25, 2014
Applicants:
Tu-anh N. Tran, Austin, TX (US);
David B. Clegg, Austin, TX (US);
Sohrab Safai, Austin, TX (US);
Inventors:
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 24/43 (2013.01); H01L 24/48 (2013.01); H01L 2224/02245 (2013.01); H01L 2224/85205 (2013.01);
Abstract
A semiconductor device comprises an integrated circuit including a wire bond pad and a passivation material, and a first gap between a first selected portion of the wire bond pad and the passivation material. The first gap is positioned to contain at least a first portion of a splash of the wire bond pad formed during a wire bond process.