The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
May. 10, 2007
James P. Johnston, Austin, TX (US);
Chu-chung Lee, Round Rock, TX (US);
Tu-anh N. Tran, Austin, TX (US);
James W. Miller, Austin, TX (US);
Kevin J. Hess, St. Ismier, FR;
James P. Johnston, Austin, TX (US);
Chu-Chung Lee, Round Rock, TX (US);
Tu-Anh N. Tran, Austin, TX (US);
James W. Miller, Austin, TX (US);
Kevin J. Hess, St. Ismier, FR;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A packaging assembly (), such as a ball grid array package, is formed which distributes power across an interior region of an integrated circuit die () by using an encapsulated patterned leadframe conductor () that is disposed over the die () and bonded to a plurality of bonding pads () formed in a BGA carrier substrate () and in the interior die region, thereby electrically coupling the interior die region to an externally provided reference voltage.