The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Jan. 03, 2014
Applicants:

Sohrab Safai, Austin, TX (US);

David B. Clegg, Austin, TX (US);

Tu-anh N. Tran, Austin, TX (US);

Inventors:

Sohrab Safai, Austin, TX (US);

David B. Clegg, Austin, TX (US);

Tu-Anh N. Tran, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/485 (2006.01); B23K 20/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/43 (2013.01); H01L 24/48 (2013.01); B23K 20/004 (2013.01); B23K 20/005 (2013.01); B23K 20/007 (2013.01); H01L 23/485 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/03831 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/08059 (2013.01); H01L 2224/43 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/01013 (2013.01);
Abstract

A conductive structure is formed in a last metal layer of an integrated circuit. Passivation material is patterned over a portion of the conductive structure. A first trench is patterned around a selected portion of the passivation material. The selected portion represents a bond region of a wire bond to be formed above the passivation material. A portion of the passivation material completely covers a bottom of the trench. A layer of conductive material is conformally deposited over the passivation material. The conformal depositing resulting in a second trench forming in the conductive material over the first trench in the passivation material. The second trench is positioned to contain at least a portion of a splash of the conductive material when the wire bond is subsequently formed.


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