The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Oct. 04, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Thomas Weiss, Poughkeepsie, NY (US);

Charles L. Arvin, Poughkeepsie, NY (US);

Glenn A. Pomerantz, Kerhonkson, NY (US);

Rachel E. Olson, Lagrangeville, NY (US);

Mark W. Kapfhammer, Poughkeepsie, NY (US);

Bhupender Singh, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 23/538 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 21/6835 (2013.01); H01L 23/49816 (2013.01); H01L 24/09 (2013.01); H01L 24/14 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/09177 (2013.01); H01L 2224/09179 (2013.01); H01L 2224/09515 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/81815 (2013.01);
Abstract

An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.


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