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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11121101 B1

PDFFull Text
Expired
Date of Patent:
Sep. 14, 2021

Filed:

Jan. 30, 2020

Flip chip packaging rework

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles Leon Arvin, Poughkeepsie, NY (US);

Karen P. McLaughlin, Poughkeepsie, NY (US);

Thomas Anthony Wassick, LaGrangeville, NY (US);

Brian W. Quinlan, Poughkeepsie, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Cantor Colburn LLP

L. Jeffrey Kelly

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/0381 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0569 (2013.01); H01L 2224/05584 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05684 (2013.01); H01L 2924/07025 (2013.01);
Abstract

Rework and recovery processes generally include application of liquid metal etchant compositions to selectively remove one layer at a time of a solder layer and underball metallurgy multilayer stack including a titanium-based adhesion layer, a copper seed layer, a plated copper conductor layer, and a nickel-based barrier layer. The rework and recovery process can be applied to the dies, wafers, and/or substrate.

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Arvin, Charles. (2021). Flip chip packaging rework (U.S. Patent No. 11121101). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11121101

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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