Poughkeepsie, NY, United States of America

Karen P McLaughlin

USPTO Granted Patents = 10 (Patent Applications = 1)

Average Co-Inventor Count = 4.7

ph-index = 4

Forward Citations = 121(Granted Patents)

Company Filing History:

9 out of 164,108

International Business Machines Corporation

Years Active: 1999-2021

where 'Filed Patents' based on already Granted Patents

10 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11121101 - Flip chip packaging rework (2021-09-14),

2. 10957650 - Bridge support structure (2021-03-23),

3. 9947598 - Determining crackstop strength of integrated circuit assembly at the wafer level (2018-04-17),

4. 9401336 - Dual layer stack for contact formation (2016-07-26),

5. 9214385 - Semiconductor device including passivation layer encapsulant (2015-12-15),

6. 8937009 - Far back end of the line metallization method and structures (2015-01-20),

7. 5985128 - Method of performing processes on features with electricity (1999-11-16),

8. 5935404 - Method of performing processes on features with electricity (1999-08-10),

9. 5896869 - Semiconductor package having etched-back silver-copper braze (1999-04-27),

10. 5869139 - Apparatus and method for plating pin grid array packaging modules (1999-02-09),

Title: **Innovative Contributions of Karen P McLaughlin**

Introduction

Karen P McLaughlin is an accomplished inventor based in Poughkeepsie, NY, with a remarkable portfolio consisting of 10 patents. Her innovations primarily focus on advancements in semiconductor technologies and packaging processes, contributing significantly to the field.

Latest Patents

Among her latest patents is the "Flip Chip Packaging Rework," which details a cutting-edge recovery process that employs liquid metal etchant compositions. This innovative approach allows for the selective removal of solder layers in a multilayer stack, optimizing the rework and recovery of dies, wafers, and substrates.

Another notable patent is the "Bridge Support Structure," involving a sophisticated module that integrates semiconductor devices with a bridge support structure. This design enhances connectivity by using multiple bonding pads, thereby improving the overall functionality and efficiency of semiconductor devices.

Career Highlights

Karen has made significant contributions while working at prominent companies such as the International Business Machines Corporation (IBM) and Globalfoundries Inc. Throughout her career, she has demonstrated a commitment to advancing technology and engineering practices in semiconductor manufacturing.

Collaborations

In her journey as an inventor, Karen has collaborated with talented individuals, including her coworkers Charles Leon Arvin and Brian Michael Erwin. These partnerships have fostered a culture of innovation and have played a pivotal role in her success as an inventor.

Conclusion

Karen P McLaughlin's work exemplifies the spirit of innovation and the impact that dedicated inventors can have in technology. With a strong focus on practical solutions in the semiconductor field, she continues to inspire future generations of inventors and engineers.

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1 patent pending:

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