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For the Inventor, By the Inventor

Nagano, Japan

Katsuya Fukase

This inventor holds 41 USPTO granted patents and 1 published patent application, primarily in Wiring Substrates. Top assignees: Shinko Electric Industries Co., Ltd., Fujitsu Corporation, Mitsubishi Paper Mills Limited. Active years: 1989-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Katsuya Fukase. Retrieved from https://idiyas.com/inventor/katsuya-fukase

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 41 

% Patents Active = 82.9

Average Co-Inventor Count = 2.7

ph-index = 8

Forward Citations = 454(Granted Patents)


Company Filing History:

goldMedal40 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents
silverMedal3 out of 39,374 
 
Fujitsu Corporation
 patents
bronzeMedal2 out of 622 
 
Mitsubishi Paper Mills Limited
 patents
4. 1 out of 227 
 
Shinko Electric Company, Ltd.
 patents
where one patent can have more than one assignee

Years Active: 1989-2022

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Areas of Expertise:
Wiring Substrate
Circuit Board
Semiconductor Device
Electronic Component
Manufacturing Method
Carrier Base Material
Interposer
Lead Frame
Automatic Bonding Tape
Multi-layer Substrate
Embedded Board
Insulation Layer
41 patents (USPTO):Explore Patents
1. 11289403 - Multi-layer substrate and method for manufacturing multi-layer substrate (2022-03-29),
2. 11152293 - Wiring board having two insulating films and hole penetrating therethrough (2021-10-19),
3. 10892217 - Wiring substrate and semiconductor device (2021-01-12),
4. 10707178 - Wiring substrate (2020-07-07),
5. 10510638 - Electronic component-embedded board (2019-12-17),
6. 10398027 - Wiring board (2019-08-27),
7. 10340214 - Carrier base material-added wiring substrate (2019-07-02),
8. 10321574 - Electronic component-embedded substrate and electronic component device (2019-06-11),
9. 10109580 - Wiring board and semiconductor device (2018-10-23),
10. 10080293 - Electronic component-embedded board and electronic component device (2018-09-18),
11. 10080292 - Wiring board (2018-09-18),
12. 9966331 - Wiring substrate and semiconductor device (2018-05-08),
13. 9961785 - Wiring substrate and semiconductor device (2018-05-01),
14. 9961767 - Circuit board and method of manufacturing circuit board (2018-05-01),
15. 9905504 - Carrier base material-added wiring substrate (2018-02-27),

Title: The Innovative Mind of Katsuya Fukase

Introduction: Katsuya Fukase is a renowned inventor hailing from Nagano, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Katsuya Fukase holds several patents in the areas of robotics, artificial intelligence, and sustainable energy solutions, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Fukase has worked with leading research institutions and tech companies to develop cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Katsuya Fukase has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Katsuya Fukase's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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