The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Sep. 09, 2015
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-ken, JP;

Inventors:

Junji Sato, Nagano, JP;

Kiyotaka Mochizuki, Nagano, JP;

Kazuhiro Kobayashi, Nagano, JP;

Katsuya Fukase, Nagano, JP;

Assignee:

Shinko Electric Co., Ltd., Nagano-shi, Nagano-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4697 (2013.01); H05K 1/185 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H05K 3/4652 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, and a second wiring layer formed on a second surface of the core. The first wiring layer includes a first opening, and the second wiring layer includes a second opening. The core includes a plurality of electronic component accommodating bores that extend through the core at portions exposed from the first and second openings. An electronic component is arranged in each electronic component accommodating bore. The electronic component accommodating bores are filled with an insulating layer. The core includes a partition located between adjacent electronic component accommodating bores. The partition is formed by part of the core.


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