The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Jan. 08, 2016
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Kazuhiro Oshima, Nagano, JP;

Hiroharu Yanagisawa, Nagano, JP;

Kazuhiro Kobayashi, Nagano, JP;

Katsuya Fukase, Nagano, JP;

Ken Miyairi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 7/12 (2006.01); H05K 7/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); H05K 3/007 (2013.01); H05K 3/4682 (2013.01); H05K 1/02 (2013.01); H05K 1/0296 (2013.01); H05K 1/0298 (2013.01); H05K 1/0366 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H05K 2201/01 (2013.01); H05K 2201/0183 (2013.01); H05K 2201/10 (2013.01);
Abstract

A circuit board includes an insulating layer including first and second insulator films, a first wiring layer embedded in the first insulator film and including pads and first wiring patterns exposed from the first insulator film, and a second wiring layer including second wiring patterns formed on the second insulator film and via wirings penetrating the insulating layer and electrically connecting the second wiring patterns to the first wiring layer. The first insulator film is made of a reinforcement-free resin that includes no reinforcing member. The second insulator film is made of a reinforcing member impregnated with a resin.


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