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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10080292 B1

PDFFull Text
Date of Patent:
Sep. 18, 2018

Filed:

Jun. 28, 2017

Wiring board

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Junji Sato, Nagano, JP;

Hitoshi Kondo, Nagano, JP;

Katsuya Fukase, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Michael P McFadden

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H05K 3/46 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/3157 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/0657 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 3/4007 (2013.01); H05K 3/424 (2013.01); H05K 3/4682 (2013.01); H01L 24/16 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/386 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10977 (2013.01);
Abstract

A wiring board includes an electronic component; an insulating layer containing the electronic component therein, and including a via hole that is open at one surface of the insulating layer to expose an electrode of the electronic component; a first wiring layer embedded in the insulating layer, one surface of the first wiring layer being exposed at the one surface of the insulating layer; a second wiring layer including a wiring pattern formed on the one surface of the first wiring layer, and a via wiring extended from the wiring pattern to be extended in the via hole and directly connected to an electrode of the electronic component.

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