The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Sep. 25, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-Shi, Nagano-Ken, JP;

Inventors:

Junji Sato, Nagano, JP;

Hitoshi Kondo, Nagano, JP;

Katsuya Fukase, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H05K 3/34 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 22/14 (2013.01); H01L 22/20 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81005 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A carrier base material-added wiring substrate includes a wiring substrate and a carrier base material. The wiring substrate includes an insulation layer, a wiring layer arranged on a lower surface of the insulation layer, and a solder resist layer that covers the lower surface of the insulation layer and includes an opening that exposes a portion of the wiring layer as an external connection terminal. The carrier base material is adhered by an adhesive layer to the solder resist layer. The carrier base material includes an opening that is in communication with the opening of the solder resist layer and exposes the external connection terminal. The opening of the carrier base material has a diameter that is smaller than that of the opening of the solder resist layer.


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