The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Jul. 25, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Junji Sato, Nagano, JP;

Katsuya Fukase, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/6836 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10522 (2013.01);
Abstract

An electronic component-embedded board includes: a core substrate; a cavity which penetrates the core substrate; a wiring layer formed on one face of the core substrate; a component mounting pattern formed of the same material as the wiring layer and laid across the cavity to partition the cavity into through holes in plan view; an electronic component mounted on the component mounting pattern and arranged inside the cavity; a first insulating layer formed on the one face of the core substrate to cover one face of the electronic component; and a second insulating layer formed on the other face of the core substrate to cover the other face of the electronic component. The cavity is filled with the first insulating layer and the second insulating layer.


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