Nagano, Japan

Kei Murayama

USPTO Granted Patents = 121 

 

Average Co-Inventor Count = 2.3

ph-index = 16

Forward Citations = 923(Granted Patents)


Inventors with similar research interests:


Location History:

  • Nagano-Ken, JP (2017)
  • Nagano, JP (1998 - 2023)

Company Filing History:


Years Active: 1998-2023

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Device
Wiring Substrate
Electronic Component Package
Interposer
Heat Radiation Component
Conductive Ball
Solder Bump Joining Structure
Silicon Substrate
Multi-Chip Packaging
Light-Emitting Device
Composite Wiring Substrate
Electronic Parts Packaging
121 patents (USPTO):Explore Patents

Title: Kei Murayama: Pioneering Innovator in Composite Wiring Substrate and Semiconductor Devices

Introduction:

In the realm of technological advancements, Kei Murayama, a skilled inventor based in Nagano, Japan, has made a significant impact with his groundbreaking patents. With a remarkable repertoire of 120 patents to his name, Murayama has demonstrated commendable expertise in developing composite wiring substrates and semiconductor devices. This article sheds light on his latest patents, career highlights, notable collaborations, and the invaluable contributions he has made to the field of innovations.

Latest Patents:

Among Murayama's recent patents, his work on composite wiring substrate and semiconductor devices stands out. One of his notable creations involves a composite wiring substrate comprising two wiring substrates joined together through a joint material. This joint material utilizes an intermetallic alloy of copper and tin and an alloy of tin and bismuth, with the latter having a higher concentration of bismuth than the eutectic composition of a tin-bismuth alloy. This inventive solution allows for effective connection while maintaining structural integrity.

Another noteworthy patent by Murayama involves a wiring substrate with a unique structure. This substrate consists of a wiring layer and an insulating layer, along with several first posts formed around a specific area, and a second post connected to the wiring layer within the surrounded region. The first posts are strategically designed to have varied heights, with the central post being lower than the posts at the ends, contributing to enhanced functionality and design flexibility.

Career Highlights:

Kei Murayama has dedicated his career to developing innovative solutions in the field of composite wiring substrates and semiconductor devices. A significant part of his professional journey includes working at renowned companies such as Shinko Electric Industries Co., Ltd. and Shinko Electric Electric Industries Co., Ltd. These esteemed organizations provided him with ample opportunities to thrive and contribute his expertise to cutting-edge projects.

Collaborations:

Throughout his career, Murayama has had the privilege of collaborating with exceptional colleagues who have supported his inventive endeavors. Notably, his work has been complemented by the contributions of Mitsutoshi Higashi and Masahiro Sunohara, both esteemed professionals in the field. Together, they have combined their skills and knowledge to create innovative solutions that have the potential to revolutionize the industry.

Conclusion:

Kei Murayama's impressive portfolio of 120 patents, along with his exceptional work in the development of composite wiring substrates and semiconductor devices, cements his position as a pioneering innovator in the field. His creations, including the composite wiring substrate with advanced joint materials and the specialized wiring substrate structure, showcase his commitment to pushing technological boundaries. As Murayama's accomplishments continue to shape the industry, his collaborations and career highlights serve as a testament to his ingenuity and relentless pursuit of innovation.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…