The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Mar. 10, 2014
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Kei Murayama, Nagano, JP;

Mitsuhiro Aizawa, Nagano, JP;

Koji Hara, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H05K 1/03 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 3/467 (2013.01); H01L 23/00 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H05K 1/0306 (2013.01); H05K 3/4061 (2013.01); H05K 3/4688 (2013.01); H05K 2201/0179 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10378 (2013.01);
Abstract

An interposer includes a wiring member including a first inorganic substrate, a reinforcement member including a second inorganic substrate, and an adhesive part interposed between the wiring member and the reinforcement member. Each of the first and second inorganic substrates includes first and second surfaces. Multiple inorganic insulating layers formed on the first surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in a vertical direction with the adhesive part centered therebetween. An inorganic insulating layer and an organic insulating layer formed on the second surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in the vertical direction with the adhesive part. An organic insulating layer formed on the second surface of each of the first and second inorganic substrates is an outermost insulating layer.


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