The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Mar. 15, 2013
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Kei Murayama, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 2224/3225 (2013.01); H01L 2924/19107 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/1029 (2013.01); H01L 2224/97 (2013.01); H01L 2224/45147 (2013.01); H01L 24/49 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/15331 (2013.01); H01L 24/97 (2013.01); H01L 21/56 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/48227 (2013.01); H01L 24/45 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/10253 (2013.01);
Abstract
A stacked semiconductor device includes a unit component including a wiring portion formed by electrically connecting a die pad of and a lead of a lead frame, and a semiconductor package whose connection terminal is connected to the lead, wherein the unit component is stacked, and the leads located to upper and lower sides are connected mutually via an electrode.