The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2015

Filed:

Jun. 11, 2013
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Kei Murayama, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 7/02 (2006.01); H05K 5/00 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); H01L 23/10 (2013.01); H05K 5/0091 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/1461 (2013.01);
Abstract

An electronic device includes: a housing having a concave portion in the first surface of the housing; a lid made of a semiconductor material containing an impurity material; a first metal film formed in a metal film formation region on the first surface of the housing, wherein the metal film formation region is defined as a region surrounding the concave portion on the first surface of the housing; a second metal film formed on the first surface of the lid to overlap with the metal film formation region in a top view of the electronic device; a third metal film formed on the second surface of the lid to overlap with the metal film formation region in the top view; and an electronic component disposed in the concave portion. The lid is bonded onto the housing via the first and second metal films to cover the electronic component.


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