The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
May. 26, 2023
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Masayuki Mizuno, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 3/20 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H01L 23/49822 (2013.01); H05K 1/112 (2013.01); H05K 3/205 (2013.01); H05K 2201/09563 (2013.01);
Abstract
A wiring board includes a first wiring layer, an insulating layer that is arranged on the first wiring layer, and a second wiring layer that is arranged on the insulating layer. The first wiring layer includes a first plain layer, an opening that penetrates through the first plain layer, and a reinforcing pad that is arranged in the opening. The second wiring layer includes a second plain layer. The insulating layer includes a reinforcing via that connects the reinforcing pad and the second plain layer.