The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

May. 18, 2023
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Takamasa Nagasawa, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/20 (2006.01); B32B 15/08 (2006.01); B32B 18/00 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B32B 3/20 (2013.01); B32B 15/08 (2013.01); B32B 18/00 (2013.01); B32B 2250/40 (2013.01); B32B 2307/202 (2013.01); B32B 2307/302 (2013.01); B82Y 30/00 (2013.01);
Abstract

A substrate includes a heat conduction member including a plurality of carbon nanotubes, a first resin layer provided on first ends of the plurality of carbon nanotubes, and a second resin layer provided on second ends of the plurality of carbon nanotubes, the second ends being opposite the first ends, a first metal layer laminated on the first resin layer, and a second metal layer laminated on the second resin layer, wherein neither the first resin layer nor the second resin layer contains a filler, and wherein spaces between the first ends of the plurality of carbon nanotubes are filled with a resin constituting the first resin layer, and spaces between the second ends of the plurality of carbon nanotubes are filled with a resin constituting the second resin layer.


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