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For the Inventor, By the Inventor

Nagano, Japan

Hideaki Sakaguchi

This inventor holds 82 USPTO granted patents and 3 published patent applications and 8 EPO patents, primarily in Semiconductor Packaging (CPC class H01L2224-16225). Top assignees: Shinko Electric Industries Co., Ltd., Taiyo Yuden Co., Ltd., Adv Antest Corporation. Active years: 2001-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideaki Sakaguchi. Retrieved from https://idiyas.com/inventor/hideaki-sakaguchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 82 

% Patents Active = 61.0

 

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 469(Granted Patents)

Forward Citations (Not Self Cited) = 461(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Nagano-ken, JP (2014)
  • Nagano, JP (2001 - 2020)

Company Filing History:

goldMedal82 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents
silverMedal2 out of 1,769 
 
Taiyo Yuden Co., Ltd.
 patents
bronzeMedal1 out of 2,282 
 
Adv Antest Corporation
 patents
where one patent can have more than one assignee

Years Active: 2001-2020

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Areas of Expertise:
Bioelectrode Component
Electronic Device
Interposer
Chip Embedded Substrate
Wiring Board
Probe Card
Semiconductor Package
Conductive Ball Mounting
Electronic Part Embedded Substrate
Wiring Substrate
Light-Emitting Device
Sensing Apparatus
82 patents (USPTO):Explore Patents
1. 10588533 - Bioelectrode component (2020-03-17),
2. 10206283 - Electronic device (2019-02-12),
3. 10134680 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2018-11-20),
4. 9768122 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2017-09-19),
5. 9646924 - Interposer, method for manufacturing interposer, and semiconductor device (2017-05-09),
6. 9591742 - Interposer and semiconductor device including the same (2017-03-07),
7. 9451702 - Chip embedded substrate and method of producing the same (2016-09-20),
8. 9434604 - Cap, semiconductor device including the cap, and manufacturing method therefor (2016-09-06),
9. 9052341 - Probe card and manufacturing method thereof (2015-06-09),
10. 8922234 - Probe card and method for manufacturing probe card (2014-12-30),
11. 8922232 - Test-use individual substrate, probe, and semiconductor wafer testing apparatus (2014-12-30),
12. 8810007 - Wiring board, semiconductor device, and method for manufacturing wiring board (2014-08-19),
13. 8793868 - Chip embedded substrate and method of producing the same (2014-08-05),
14. 8777638 - Wiring board and method of manufacturing the same (2014-07-15),
15. 8759685 - Wiring substrate and method of manufacturing the wiring substrate (2014-06-24),

Title: The Innovative Mind of Hideaki Sakaguchi

Introduction: Hideaki Sakaguchi is a renowned inventor hailing from Nagano, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hideaki Sakaguchi holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous dedication to pushing the boundaries of what is possible.

Career Highlights: With a career spanning over two decades, Hideaki Sakaguchi has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Hideaki Sakaguchi has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Hideaki Sakaguchi's passion for innovation and his relentless drive to create solutions for the future make him a true pioneer in the world of technology, inspiring the next generation of inventors to dream big and think outside the box.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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