Hideaki Sakaguchi

This inventor holds 82 USPTO granted patents and 3 published patent applications and 8 EPO patents, primarily in Semiconductor Packaging (CPC class H01L2224-16225). Top assignees: Shinko Electric Industries Co., Ltd., Taiyo Yuden Co., Ltd., Adv Antest Corporation. Active years: 2001-2020.

USPTO Granted Patents = 82 (Patent Applications = 3)

% Patents Active = 61.0

EPO Patents = 8 (Patent Applications = 7)

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 469(Granted Patents)

Forward Citations (Not Self Cited) = 461(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Nagano-ken, JP (2014)
Nagano, JP (2001 - 2020)

Company Filing History:

82 out of 1,704

Shinko Electric Industries Co., Ltd.

patents

2 out of 1,769

Taiyo Yuden Co., Ltd.

patents

1 out of 2,280

Adv Antest Corporation

patents

where one patent can have more than one assignee

Years Active: 2001-2020

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Areas of Expertise:

Bioelectrode Component

Electronic Device

Interposer

Chip Embedded Substrate

Wiring Board

Probe Card

Semiconductor Package

Conductive Ball Mounting

Electronic Part Embedded Substrate

Wiring Substrate

Light-Emitting Device

Sensing Apparatus

82 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10588533 - Bioelectrode component (2020-03-17),

2. 10206283 - Electronic device (2019-02-12),

3. 10134680 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2018-11-20),

4. 9768122 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2017-09-19),

5. 9646924 - Interposer, method for manufacturing interposer, and semiconductor device (2017-05-09),

6. 9591742 - Interposer and semiconductor device including the same (2017-03-07),

7. 9451702 - Chip embedded substrate and method of producing the same (2016-09-20),

8. 9434604 - Cap, semiconductor device including the cap, and manufacturing method therefor (2016-09-06),

9. 9052341 - Probe card and manufacturing method thereof (2015-06-09),

10. 8922234 - Probe card and method for manufacturing probe card (2014-12-30),

11. 8922232 - Test-use individual substrate, probe, and semiconductor wafer testing apparatus (2014-12-30),

12. 8810007 - Wiring board, semiconductor device, and method for manufacturing wiring board (2014-08-19),

13. 8793868 - Chip embedded substrate and method of producing the same (2014-08-05),

14. 8777638 - Wiring board and method of manufacturing the same (2014-07-15),

15. 8759685 - Wiring substrate and method of manufacturing the wiring substrate (2014-06-24),

Title: The Innovative Mind of Hideaki Sakaguchi

Introduction: Hideaki Sakaguchi is a renowned inventor hailing from Nagano, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hideaki Sakaguchi holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous dedication to pushing the boundaries of what is possible.

Career Highlights: With a career spanning over two decades, Hideaki Sakaguchi has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Hideaki Sakaguchi has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Hideaki Sakaguchi's passion for innovation and his relentless drive to create solutions for the future make him a true pioneer in the world of technology, inspiring the next generation of inventors to dream big and think outside the box.