The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Apr. 17, 2012
Akihito Takano, Nagano-ken, JP;
Masahiro Sunohara, Grenoble, FR;
Hideaki Sakaguchi, Nagano-ken, JP;
Mitsutoshi Higashi, Nagano-ken, JP;
Kenichi Ota, Taito-ku, JP;
Yuichi Sasajima, Tokyo, JP;
Akihito Takano, Nagano-ken, JP;
Masahiro Sunohara, Grenoble, FR;
Hideaki Sakaguchi, Nagano-ken, JP;
Mitsutoshi Higashi, Nagano-ken, JP;
Kenichi Ota, Taito-ku, JP;
Yuichi Sasajima, Tokyo, JP;
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part.