Shinko Electric Industries Co., Ltd.

Taiyo Yuden Co., Ltd.

Adv Antest Corporation

Hideaki Sakaguchi

Mitsutoshi Higashi

Masahiro Sunohara

Akinori Shiraishi

Kei Murayama

Yuichi Taguchi

Kiyoaki Iida

Naoyuki Koizumi

Hiroko Koike

Tsuyoshi Kobayashi

Kazuo Tanaka

Takaharu Yamano

Tadashi Arai

Yuji Kunimoto

Koichi Tanaka

Hajime Iizuka

Toshio Kobayashi

Tetsuya Koyama

Takashi Yanagisawa

Tomoaki Mashima

Takashi Mochizuki

Akihito Takano

Kenichi Ota

Yuichi Sasajima

Norio Kondo

Shigeru Matsumura

Takashi Kurihara

Yukiharu Takeuchi

Yoshihiro Ihara

Hiroshi Shimizu

Masayuki Sasaki

Kosuke Fujihara

Katsushi Sugai

Koji Nagai

Kohei Kato

Nobuyuki Machida

Kenkichi Arai

Koichi Shiroyama

A bioelectrode component includes an electrode member. The electrode member includes a metal plate, a coupling bar, and a needle part. The metal plate includes a first surface and a second surface opposite to the first surface, and includes an opening formed in the metal plate. The coupling bar extends inward from an inner wall of the opening. The needle part is arranged at a leading end of the coupling bar and protrudes toward the first surface of the metal plate.

Bioelectrode component

An electronic device includes a first wiring substrate having a first main surface, first conductive contacts, each of which is provided upright on the first main surface, has a U-shape opening toward a side of the first wiring substrate, and comprises a first contact part extending toward the side of the first wiring substrate, a second wiring substrate having a second main surface, second conductive contacts, each of which is provided upright on the second main surface, has a U-shape opening toward a side of the second wiring substrate, and comprises a second contact part extending toward the side of the second wiring substrate and being in contact with the first contact part, and, third conductive contacts, each of which has a U-shape opening toward the conductive contacts and is configured to sandwich the first and second contact parts and to fix the first and second wiring substrates.

Electronic device

An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Electrodes pads formed on device surfaces connect semiconductor chips to through electrodes of an intermediate substrate. A flow path is formed inside the intermediate substrate. A cooling medium flows through the flow path. Stoppers are attached to an inner surface of the flow path. The stoppers include metal abutment members, respectively. An end of each pipe abuts against the counterpart abutment member. Solder connects the pipes to the abutment members.

Interposer, method for manufacturing interposer, and semiconductor device

There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.

Interposer and semiconductor device including the same

Chip embedded substrate and method of producing the same

A cap for installing a semiconductor device that can send or receive a light having a predetermined wavelength, the cap including a recess for installing the semiconductor device, the recess being defined by a through-hole penetrating an upper surface of a silicon substrate and a lower surface of the silicon substrate, the through-hole having an upper end part of the through-hole on a side of the upper surface of the silicon substrate and a lower end part of the through-hole on a side of the lower surface of the silicon substrate, and a coating film formed to cover the upper surface of the silicon substrate and the upper end part of the through-hole, wherein the coating film that covers the upper end part of the through-hole is a window part that transmits the light having a predetermined wavelength.

Cap, semiconductor device including the cap, and manufacturing method therefor

In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.

Probe card and manufacturing method thereof

A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.

Probe card and method for manufacturing probe card

[Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substratewhich is used for testing a semiconductor wafer, comprises a main body portion, thin portionsextending from the main body portionand being relatively thinner than the main body portion, and bumpsprovided on the thin portions

Test-use individual substrate, probe, and semiconductor wafer testing apparatus

A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part.

Wiring board, semiconductor device, and method for manufacturing wiring board

A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

Wiring board and method of manufacturing the same

A wiring substrate includes a substrate body including first and second surfaces on opposite sides and a substrate side surface; a penetration electrode penetrating through the substrate body; a first wiring pattern on the first surface and including a first pad; a second wiring pattern on the second surface and including a second pad; a first insulating resin layer covering the first wiring pattern except for an area corresponding to the first pad and having a first resin side surface; a second insulating resin layer covering the second wiring pattern except for an area corresponding to the second pad and having a second resin side surface that is flush with the first resin side surface; a notch part encompassing at least apart of the substrate body and having a resin material provided therein. The substrate side surface is located more inward than the first and second resin side surfaces.

Wiring substrate and method of manufacturing the wiring substrate

Growing community of inventors

Nagano, Japan

Hideaki Sakaguchi