The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Aug. 18, 2011
Shigeru Matsumura, Saitama, JP;
Kohei Kato, Gunma, JP;
Katsushi Sugai, Saitama, JP;
Koichi Shiroyama, Saitama, JP;
Mitsutoshi Higashi, Nagano, JP;
Akinori Shiraishi, Nagano, JP;
Hideaki Sakaguchi, Nagano, JP;
Shigeru Matsumura, Saitama, JP;
Kohei Kato, Gunma, JP;
Katsushi Sugai, Saitama, JP;
Koichi Shiroyama, Saitama, JP;
Mitsutoshi Higashi, Nagano, JP;
Akinori Shiraishi, Nagano, JP;
Hideaki Sakaguchi, Nagano, JP;
Advantest Corporation, Tokyo, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
[Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substratewhich is used for testing a semiconductor wafer, comprises a main body portion, thin portionsextending from the main body portionand being relatively thinner than the main body portion, and bumpsprovided on the thin portions