The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Feb. 23, 2012
Applicants:

Akinori Shiraishi, Nagano, JP;

Hideaki Sakaguchi, Nagano, JP;

Mitsutoshi Higashi, Nagano, JP;

Inventors:

Akinori Shiraishi, Nagano, JP;

Hideaki Sakaguchi, Nagano, JP;

Mitsutoshi Higashi, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/00 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 3/00 (2013.01); Y10T 29/49117 (2015.01); G01R 1/07378 (2013.01); G01R 31/2889 (2013.01);
Abstract

In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.


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