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Takaharu Yamano

USPTO Granted Patents = 57 (Patent Applications = 1)

EPO Patents = 4 (Patent Applications = 4)

Average Co-Inventor Count = 1.6

ph-index = 12

Forward Citations = 342(Granted Patents)

Forward Citations (Not Self Cited) = 337(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

57 out of 1,700

Shinko Electric Industries Co., Ltd.

Years Active: 2006-2022

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Areas of Expertise:

Semiconductor Device

Chip Embedded Substrate

Electronic Part Embedded Substrate

Semiconductor Package

Wiring Board

Manufacturing Method

Through Electrode

Electronic Device Manufacturing

Stacked Semiconductor Apparatus

Plating Method

Substrate Manufacturing

Reinforcement Plate

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11322478 - Semiconductor device and semiconductor device array (2022-05-03),

2. 10134680 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2018-11-20),

3. 9768122 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2017-09-19),

4. 9564364 - Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor package (2017-02-07),

5. 9451702 - Chip embedded substrate and method of producing the same (2016-09-20),

6. 9048225 - Semiconductor device and method for manufacturing semiconductor device (2015-06-02),

7. 8793868 - Chip embedded substrate and method of producing the same (2014-08-05),

8. 8779573 - Semiconductor package having a silicon reinforcing member embedded in resin (2014-07-15),

9. 8564116 - Semiconductor device with reinforcement plate and method of forming same (2013-10-22),

10. 8415796 - Semiconductor device having a multilayer structure (2013-04-09),

11. 8402644 - Method of manufacturing an electronic parts packaging structure (2013-03-26),

12. 8349733 - Manufacturing method of substrate with through electrode (2013-01-08),

13. 8299586 - Semiconductor device and method of manufacturing the same (2012-10-30),

14. 8253229 - Semiconductor package and stacked layer type semiconductor package (2012-08-28),

15. 8232639 - Semiconductor-device mounted board and method of manufacturing the same (2012-07-31),

Title: The Innovative Journey of Takaharu Yamano

Introduction:

Takaharu Yamano, a visionary inventor hailing from Nagano, Japan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents:

Takaharu Yamano's latest patents include cutting-edge advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his commitment to driving innovation in various sectors.

Career Highlights:

With a career spanning over two decades, Takaharu Yamano has established himself as a leading figure in the tech industry, known for his ability to transform bold ideas into tangible products that shape the future.

Collaborations:

Throughout his career, Takaharu Yamano has collaborated with top research institutions, universities, and tech companies worldwide, fostering a culture of innovation and knowledge exchange that has led to groundbreaking discoveries.

Conclusion:

In conclusion, Takaharu Yamano's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible have solidified his reputation as a trailblazing inventor in the global tech landscape.

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