Hsinchu, Taiwan

Chia-Chung Wang

USPTO Granted Patents = 101 

Average Co-Inventor Count = 2.1

ph-index = 11

Forward Citations = 639(Granted Patents)

DiyaCoin DiyaCoin 1.24 


Inventors with similar research interests:


Location History:

  • Bode, TW (2002)
  • Bade, TW (2003)
  • Hsinchu, TW (2001 - 2015)
  • Judung Jen Hsinchu, TW (2013 - 2015)
  • Hsinchu County, TW (2015 - 2022)

Company Filing History:


Years Active: 2001-2022

where 'Filed Patents' based on already Granted Patents

101 patents (USPTO):

Title: Innovations and Contributions of Chia-Chung Wang in the Field of Semiconductor Technology

Introduction: Chia-Chung Wang, a prolific inventor based in Hsinchu, Taiwan, has an impressive portfolio of 101 patents. His work has significantly influenced advancements in semiconductor technology, particularly in the design and functionality of electronic components.

Latest Patents: Among his latest contributions are two notable patents. The first is a "Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same." This innovative leadframe substrate features a modulator, a number of metal leads, a resin layer, and a crack inhibiting structure. The resin layer plays a critical role in creating mechanical bonds between the modulator and the surrounding metal leads, while the crack inhibiting structure incorporates a continuous interlocking fiber sheet that helps prevent cracks within the resin layer from extending to the top surfaces, thereby maintaining signal integrity.

The second patent is for an "Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same." This interconnect substrate includes a stiffener with an elastic modulus higher than 100 GPa surrounded by a core layer, as well as a warp balancer situated above the core layer. This innovative design counterbalances local thermo-mechanical stress caused by uneven thickness, enhancing the overall performance and reliability of the semiconductor assembly.

Career Highlights: Throughout his career, Chia-Chung Wang has had the opportunity to work with leading companies in the technology sector, including Bridge Semiconductor Corporation and the Industrial Technology Research Institute. His expertise and innovations have allowed him to make substantial contributions to various projects focused on enhancing semiconductor technology.

Collaborations: Chia-Chung has collaborated with respected colleagues such as Charles W. C. Lin and Sangwhoo Lim. These collaborations have propelled forward-thinking solutions in the field, fostering a spirit of innovation and excellence.

Conclusion: Chia-Chung Wang's extensive body of work and his commitment to innovation have established him as a key figure in semiconductor technology. His latest patents demonstrate his forward-thinking approach and dedication to improving electronic component design, ultimately leading to significant advancements in the industry.

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