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For the Inventor, By the Inventor

Singapore, Singapore

Charles W C Lin

USPTO Granted Patents = 170 

Average Co-Inventor Count = 1.7

ph-index = 26

Forward Citations = 2,784(Granted Patents)


Inventors with similar research interests:


Location History:

  • Singapore 229666, SG (2002)
  • Singapore 738290, SG (2002 - 2003)
  • Taipei County, TW (2010)
  • Taipei, TW (2019)
  • Singapore, SG (2002 - 2022)

Company Filing History:

goldMedal145 out of 164 
 
Bridge Semiconductor Corporation
 patents
silverMedal1 out of 1 
 
Brodge Semiconductor Corporation
 patent
bronzeMedal24 out of 832,680 
Other
 patents

Years Active: 2002-2022

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170 patents (USPTO):
1. 11291146 - Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same (2022-03-29),
2. 10804205 - Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same (2020-10-13),
3. 10546808 - Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly (2020-01-28),
4. 10446526 - Face-to-face semiconductor assembly having semiconductor device in dielectric recess (2019-10-15),
5. 10420204 - Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same (2019-09-17),
6. 10361151 - Wiring board having isolator and bridging element and method of making wiring board (2019-07-23),
7. 10354984 - Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same (2019-07-16),
8. 10306777 - Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same (2019-05-28),
9. 10269722 - Wiring board having component integrated with leadframe and method of making the same (2019-04-23),
10. 10242964 - Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same (2019-03-26),
11. 10217710 - Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same (2019-02-26),
12. 10211067 - Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly (2019-02-19),
13. 10199321 - Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same (2019-02-05),
14. 10177130 - Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener (2019-01-08),
15. 10177090 - Package-on-package semiconductor assembly having bottom device confined by dielectric recess (2019-01-08),

Title: Charles W C Lin: Mastermind Behind Innovative Patents

Introduction:

Innovation is the key driver of progress, and inventors like Charles W C Lin continue to push the boundaries of what is possible. Hailing from Singapore, Charles W C Lin has made significant contributions to the field of technology with his impressive portfolio of 170 patents. His latest inventions, including leadframe substrates with modulator and crack inhibiting structures, and interconnect substrates with stiffeners and warp balancers, highlight his commitment to enhancing signal integrity and achieving global flatness. Let's delve deeper into Charles W C Lin's notable achievements and career highlights.

Latest Patents:

Charles W C Lin's recent patents showcase his expertise in developing advanced technologies. The leadframe substrate with a modulator and crack inhibiting structure demonstrates his ability to ensure signal integrity in flip chip assemblies. By incorporating a resin layer and a continuous interlocking fiber sheet, it effectively prevents segregation and cracks from interfering with the performance of the assembly.

Similarly, his invention of the interconnect substrate with a stiffener and warp balancer exemplifies his dedication to solving technical challenges. This design combines a high modulus stiffener with a warp balancer, maintaining cavity area stiffness and modulating global flatness. Such innovations address issues related to uneven thickness, local thermo-mechanical stress, and overall stability of the substrate.

Career Highlights:

Charles W C Lin has garnered extensive experience throughout his career, working with reputable companies in the industry. His exceptional skills and knowledge were honed during his tenure at Bridge Semiconductor Corporation, where he played a crucial role in pioneering cutting-edge technologies. The company has gained recognition for its commitment to developing high-performance semiconductor solutions.

Additionally, Charles W C Lin has collaborated with talented individuals like Chia-Chung Wang and Cheng-Lien Chiang. These partnerships have proven instrumental in fostering an environment of innovation and creativity, leading to groundbreaking discoveries in the field of technology.

Collaborations:

Charles W C Lin's collaborations with his coworkers have played a vital role in his career. Working alongside Chia-Chung Wang and Cheng-Lien Chiang, both accomplished professionals in their own right, has allowed for the exchange of ideas and the creation of synergies in their research endeavors. Their joint efforts have contributed to the advancements in the semiconductor industry and have resulted in numerous patents that have reshaped technological landscapes.

Conclusion:

Charles W C Lin's remarkable achievements in the realm of technology and his extensive patent portfolio highlight his dedication to innovation and problem-solving. His expertise in developing leadframe substrates and interconnect substrates with advanced features illustrate his ability to tackle existing challenges and push forward technological boundaries. Charles W C Lin's collaborations with esteemed individuals have further enriched his career, fostering an environment of shared knowledge and expertise.

As we continue to witness advancements in various industries, inventors and innovators like Charles W C Lin will undoubtedly play a significant role in shaping the future. It is through their perseverance and ability to think beyond limits that we are presented with new possibilities and solutions. Charles W C Lin undoubtedly exemplifies the spirit of ingenuity and a true passion for making a mark in the world of technology.

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