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Bridge Semiconductor Corporation

USPTO Granted Patents = 164

Forward Citations = 2,367

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14 inventors (with patents filed for the assignee):

Charles W C Lin (145 out of 170 patents)

Chia-Chung Wang (97 out of 101 patents)

Cheng-Lien Chiang (39 out of 49 patents)

4. Cheng-Chung Chen (10 out of 18 patents)

5. Sangwhoo Lim (10 out of 10 patents)

6. David M Sigmond (4 out of 6 patents)

7. Charles Wc Lin (3 out of 5 patents)

8. Arthur E Uber, Iii (2 out of 136 patents)

9. Robert Eric Uber (2 out of 12 patents)

10. Ming Yu Shih (2 out of 2 patents)

11. Chuen-Rong Leu (2 out of 2 patents)

12. Joshua J Ziff (2 out of 2 patents)

13. Chia Chung Wang (2 out of 2 patents)

14. Chin Hock Tan (1 out of 1 patent)

Core Competencies:

Leadframe Substrate

Interconnect Substrate

Wiring Board

Semiconductor Assembly

Thermally Enhanced Characteristics

Face-to-Face Assembly

Stackable Semiconductor Assembly

Embedded Component

Electromagnetic Shielding

Built-In Stiffener

Cavity Substrate

Hybrid Wiring Board

164 patents: Sort by Forward Citations

1. 11291146 - Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same (2022-03-29),

2. 10804205 - Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same (2020-10-13),

3. 10546808 - Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly (2020-01-28),

4. 10446526 - Face-to-face semiconductor assembly having semiconductor device in dielectric recess (2019-10-15),

5. 10420204 - Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same (2019-09-17),

6. 10361151 - Wiring board having isolator and bridging element and method of making wiring board (2019-07-23),

7. 10354984 - Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same (2019-07-16),

8. 10306777 - Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same (2019-05-28),

9. 10269722 - Wiring board having component integrated with leadframe and method of making the same (2019-04-23),

10. 10242964 - Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same (2019-03-26),

11. 10217710 - Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same (2019-02-26),

12. 10211067 - Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly (2019-02-19),

13. 10199321 - Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same (2019-02-05),

14. 10177130 - Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener (2019-01-08),

15. 10177090 - Package-on-package semiconductor assembly having bottom device confined by dielectric recess (2019-01-08),

Bridge Semiconductor Corporation is a leading semiconductor company specializing in the design and manufacturing of cutting-edge integrated circuits. With a focus on innovation, reliability, and quality, we provide our customers with a wide range of advanced semiconductor solutions for various industries. Our products are used in applications such as telecommunications, automotive electronics, consumer electronics, and industrial automation. Visit our website to learn more about our industry-leading technologies and solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

164 Patents

#48 in Taipei

#149 in Taiwan

#4,899 in the World

Bridge Semiconductor Corporation

Forward Citations = 2,367

14 inventors:

Charles W C Lin (145 out of 170 patents)

Chia-Chung Wang (97 out of 101 patents)

Cheng-Lien Chiang (39 out of 49 patents)

4. Cheng-Chung Chen (10 out of 18 patents)

5. Sangwhoo Lim (10 out of 10 patents)

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