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Bridge Semiconductor Corporation

USPTO Granted Patents = 166

% Expired Patents = 86.7

Forward Citations = 2,389

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14 inventors (with patents filed for the assignee):

Charles W C Lin (147 out of 172 patents)

Chia-Chung Wang (99 out of 103 patents)

Cheng-Lien Chiang (39 out of 49 patents)

4. Cheng-Chung Chen (10 out of 18 patents)

5. Sangwhoo Lim (10 out of 10 patents)

6. David M Sigmond (4 out of 6 patents)

7. Charles Wc Lin (3 out of 5 patents)

8. Arthur E Uber, Iii (2 out of 136 patents)

9. Robert Eric Uber (2 out of 12 patents)

10. Ming Yu Shih (2 out of 2 patents)

11. Chuen-Rong Leu (2 out of 2 patents)

12. Joshua J Ziff (2 out of 2 patents)

13. Chia Chung Wang (2 out of 2 patents)

14. Chin Hock Tan (1 out of 1 patent)

Core Competencies:

Thermal Management

Wiring Substrates

Stackable Designs

Electromagnetic Shielding

Dual Routing Circuitries

Embedded Components

Interconnect Substrates

Anti-Warping Controllers

Heat Spreaders

Dielectric Recess

Chip Assembly

Modulator Structures

166 patents: Sort by Forward Citations

1. 12635535 - Multi-level staggered terminal structure and semiconductor package and assembly using the same (2026-05-19),

2. 12575434 - Semiconductor assembly having dual conduction channels for electricity and heat passage (2026-03-10),

3. 11291146 - Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same (2022-03-29),

4. 10804205 - Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same (2020-10-13),

5. 10546808 - Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly (2020-01-28),

6. 10446526 - Face-to-face semiconductor assembly having semiconductor device in dielectric recess (2019-10-15),

7. 10420204 - Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same (2019-09-17),

8. 10361151 - Wiring board having isolator and bridging element and method of making wiring board (2019-07-23),

9. 10354984 - Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same (2019-07-16),

10. 10306777 - Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same (2019-05-28),

11. 10269722 - Wiring board having component integrated with leadframe and method of making the same (2019-04-23),

12. 10242964 - Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same (2019-03-26),

13. 10217710 - Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same (2019-02-26),

14. 10211067 - Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly (2019-02-19),

15. 10199321 - Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same (2019-02-05),

Company Overview

Bridge Semiconductor Corporation, headquartered in Taipei, Taiwan, specializes in semiconductor assembly technologies. The company focuses on advanced solutions in thermal management, wiring substrates, and stackable designs, catering to the evolving needs of the electronics industry. Their expertise extends to electromagnetic shielding, dual routing circuitries, embedded components, interconnect substrates, and anti-warping controllers, positioning them as a key player in enhancing semiconductor performance and reliability.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

166 Patents

#25 in Taipei

#157 in Taiwan

#4,979 in the World

Bridge Semiconductor Corporation

Forward Citations = 2,389

14 inventors:

Charles W C Lin (147 out of 172 patents)

Chia-Chung Wang (99 out of 103 patents)

Cheng-Lien Chiang (39 out of 49 patents)

4. Cheng-Chung Chen (10 out of 18 patents)

5. Sangwhoo Lim (10 out of 10 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Bridge Semiconductor Corporation. Retrieved from https://idiyas.com/company/bridge-semiconductor

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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