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Cheng-Lien Chiang

USPTO Granted Patents = 49 (Patent Applications = 2)

Average Co-Inventor Count = 1.4

ph-index = 20

Forward Citations = 1,366(Granted Patents)

Company Filing History:

Bridge Semiconductor Corporation

Industrial Technology Research Institute

Nichepac Technology Inc.

Apack Technologies Inc.

Years Active: 1998-2011

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Areas of Expertise:

Semiconductor Chip Assembly

Three-Dimensional Stacked Semiconductor Package

Optoelectronic Semiconductor Package

Bumped Metal Pillar

Conductive Trace

IC Adapter

Light Emitting Diode Package

Compliant Test Probe

Multichip Semiconductor Package

Insulative Housing

Embedded Metal Particle

Testing Device

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7940070 - Singulated bare die testing fixture (2011-05-10),

2. 7871274 - IC adapter for removably mounting integrated circuit (2011-01-18),

3. 7652894 - Contact lead (2010-01-26),

4. 7622795 - Light emitting diode package (2009-11-24),

5. 7459385 - Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler (2008-12-02),

6. 7417314 - Semiconductor chip assembly with laterally aligned bumped terminal and filler (2008-08-26),

7. 7262082 - Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture (2007-08-28),

8. 7227249 - Three-dimensional stacked semiconductor package with chips on opposite sides of lead (2007-06-05),

9. 7192803 - Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint (2007-03-20),

10. 7190060 - Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same (2007-03-13),

11. 7132741 - Semiconductor chip assembly with carved bumped terminal (2006-11-07),

12. 7129575 - Semiconductor chip assembly with bumped metal pillar (2006-10-31),

13. 7129113 - Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture (2006-10-31),

14. 7112521 - Method of making a semiconductor chip assembly with a bumped metal pillar (2006-09-26),

15. 7071089 - Method of making a semiconductor chip assembly with a carved bumped terminal (2006-07-04),

Title: The Innovative Journey of Cheng-Lien Chiang

Introduction:

Cheng-Lien Chiang, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations and patents.

Latest Patents:

Cheng-Lien Chiang's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, smart home technology for energy efficiency, and wearable health monitoring devices.

Career Highlights:

With a career spanning over two decades, Cheng-Lien Chiang has worked with leading tech companies in Taiwan and Silicon Valley. He has been instrumental in developing cutting-edge solutions in the fields of robotics, Internet of Things (IoT), and renewable energy.

Collaborations:

Throughout his career, Cheng-Lien Chiang has collaborated with top research institutions and universities worldwide to further his research and bring his inventions to life. His partnerships have led to the successful commercialization of several innovative products.

Conclusion:

In conclusion, Cheng-Lien Chiang's passion for innovation and his relentless pursuit of technological advancement have solidified his position as a respected inventor in the global tech community. His work continues to inspire future generations of inventors to push the boundaries of what is possible in the world of technology.

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