% Expired Patents = 42.9

Forward Citations = 113

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9 inventors (with patents filed for the assignee):

Shyi-Ching Liau (2 out of 18 patents)

Cheng-Lien Chiang (2 out of 49 patents)

Albert Lin (2 out of 3 patents)

4. Chong-Ren Maa (2 out of 8 patents)

5. Hung Hsiang Lee (1 out of 1 patent)

6. Tung-Liang Shao (1 out of 1 patent)

7. Muh-Min Yih (1 out of 1 patent)

8. Sam Chiang (1 out of 1 patent)

9. Jin-Chyuan Biar (1 out of 2 patents)

7 patents: Sort by Forward Citations

1. 6443059 - Solder screen printing process (2002-09-03),

2. 6387795 - Wafer-level packaging (2002-05-14),

3. 6376354 - Wafer-level packaging process (2002-04-23),

4. 6307256 - Semiconductor package with a stacked chip on a leadframe (2001-10-23),

5. 6259266 - Testing device and method for known good chip (2001-07-10),

6. 6258622 - Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method (2001-07-10),

7. 6221689 - Method for improving the reliability of underfill process for a chip (2001-04-24),

Company Overview

Apack Technologies Inc. is a leading provider of packaging solutions for the food and beverage industry. With over 20 years of experience, we offer a wide range of innovative products including sealing machines, filling machines, and labeling machines. Our commitment to quality and customer satisfaction sets us apart from our competitors. Contact us today to learn more about how Apack Technologies can help you streamline your packaging process.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

7 Patents

#291 in Hsinchu

#1,852 in Taiwan

Hsinchu, Taiwan

Apack Technologies Inc.

Forward Citations = 113

9 inventors:

Shyi-Ching Liau (2 out of 18 patents)

Cheng-Lien Chiang (2 out of 49 patents)

Albert Lin (2 out of 3 patents)

4. Chong-Ren Maa (2 out of 8 patents)

5. Hung Hsiang Lee (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Apack Technologies Inc.. Retrieved from https://idiyas.com/company/apack-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]