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Forward Citations = 113

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9 inventors (with patents filed for the assignee):

Shyi-Ching Liau (2 out of 18 patents)

Cheng-Lien Chiang (2 out of 49 patents)

Albert Lin (2 out of 3 patents)

4. Chong-Ren Maa (2 out of 8 patents)

5. Hung Hsiang Lee (1 out of 1 patent)

6. Tung-Liang Shao (1 out of 1 patent)

7. Muh-Min Yih (1 out of 1 patent)

8. Sam Chiang (1 out of 1 patent)

9. Jin-Chyuan Biar (1 out of 2 patents)

7 patents: Sort by Forward Citations

1. 6443059 - Solder screen printing process (2002-09-03),

2. 6387795 - Wafer-level packaging (2002-05-14),

3. 6376354 - Wafer-level packaging process (2002-04-23),

4. 6307256 - Semiconductor package with a stacked chip on a leadframe (2001-10-23),

5. 6259266 - Testing device and method for known good chip (2001-07-10),

6. 6258622 - Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method (2001-07-10),

7. 6221689 - Method for improving the reliability of underfill process for a chip (2001-04-24),

Apack Technologies Inc. is a leading provider of packaging solutions for the food and beverage industry. With over 20 years of experience, we offer a wide range of innovative products including sealing machines, filling machines, and labeling machines. Our commitment to quality and customer satisfaction sets us apart from our competitors. Contact us today to learn more about how Apack Technologies can help you streamline your packaging process.

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USPTO Data Jan 1 1976 - Dec 2 2025

7 Patents

#1 in Hsicnhu

#1,775 in Taiwan

Hsicnhu, Taiwan

Apack Technologies Inc.