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For the Inventor, By the Inventor

Hsinchu, Taiwan

Shyi-Ching Liau

This inventor holds 18 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Industrial Technology Research Institute, Apack Technologies Inc.. Active years: 2001-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shyi-Ching Liau. Retrieved from https://idiyas.com/inventor/shyi-ching-liau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18 

% Patents Active = 50.0

Average Co-Inventor Count = 3.9

ph-index = 6

Forward Citations = 254(Granted Patents)


Location History:

  • Hsinchu Hsien, TW (2008)
  • Jhudong Township, Hsinchu County, TW (2008)
  • Hsinchu County, TW (2009 - 2012)
  • Hsinchu, TW (2001 - 2015)

Company Filing History:

goldMedal16 out of 9,312 
 
Industrial Technology Research Institute
 patents
silverMedal2 out of 7 
 
Apack Technologies Inc.
 patents

Years Active: 2001-2015

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Areas of Expertise:
Wafer-to-Wafer Stacking
Interconnect Structure
Stress Buffering
Semiconductor Package
LED Lighting
Backlight Module
Heat-Pipe Device
Testing Device
Integrated Circuit
Vias
Manufacturing Method
Chip Design
18 patents (USPTO):Explore Patents
1. 9111774 - Wafer-to-wafer stack with supporting post (2015-08-18),
2. 8810031 - Wafer-to-wafer stack with supporting pedestal (2014-08-19),
3. 8283613 - Heat-pipe electric-power generating device (2012-10-09),
4. 8164165 - Wafer-to-wafer stack with supporting pedestal (2012-04-24),
5. 8123965 - Interconnect structure with stress buffering ability and the manufacturing method thereof (2012-02-28),
6. 8026603 - Interconnect structure of an integrated circuit and manufacturing method thereof (2011-09-27),
7. 7948072 - Wafer-to-wafer stacking (2011-05-24),
8. 7754599 - Structure for reducing stress for vias and fabricating method thereof (2010-07-13),
9. 7586187 - Interconnect structure with stress buffering ability and the manufacturing method thereof (2009-09-08),
10. 7545039 - Structure for reducing stress for vias and fabricating method thereof (2009-06-09),
11. 7517114 - Lighting devices (2009-04-14),
12. 7381995 - Lighting device with flipped side-structure of LEDs (2008-06-03),
13. 7375384 - Side structure of a bare LED and backlight module thereof (2008-05-20),
14. 7354178 - Structure of illuminating unit and structure of illuminating light source (2008-04-08),
15. 7314291 - LED lamp (2008-01-01),

Title: Shyi-Ching Liau - Pioneering Female Inventor from Hsinchu

Introduction: Shyi-Ching Liau is a trailblazing inventor hailing from Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Shyi-Ching Liau holds several patents in the areas of semiconductor technology, renewable energy, and medical devices, showcasing her diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Shyi-Ching Liau has worked with leading research institutions and technology companies, consistently pushing the boundaries of what is possible in the world of invention.

Collaborations: Throughout her career, Shyi-Ching Liau has collaborated with fellow inventors, researchers, and industry experts, fostering a culture of innovation and knowledge-sharing that has led to numerous breakthroughs in various fields.

Conclusion: Shyi-Ching Liau's passion for innovation, coupled with her relentless drive to make a positive impact on the world through her inventions, solidifies her status as a pioneering female inventor and a true inspiration to aspiring innovators everywhere.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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