The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Jul. 09, 2008
Yung-yu Hsu, Hsinchu, TW;
Shyi-ching Liau, Hsinchu, TW;
Ra-min Tain, Taipei County, TW;
Jr-yuan Jeng, Taipei County, TW;
Yung-Yu Hsu, Hsinchu, TW;
Shyi-Ching Liau, Hsinchu, TW;
Ra-Min Tain, Taipei County, TW;
Jr-Yuan Jeng, Taipei County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses.