Company Filing History:
Years Active: 2007-2012
Title: Yung-Yu Hsu: Innovator in Interconnect Structures
Introduction
Yung-Yu Hsu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of interconnect structures, holding a total of 6 patents. His work focuses on enhancing the reliability and flexibility of electronic devices through innovative manufacturing methods.
Latest Patents
Among his latest patents is the "Interconnect structure with stress buffering ability and the manufacturing method thereof." This invention discloses an interconnect structure designed to absorb and buffer stresses, featuring a first surface connected to a substrate or electronic device, a second surface, and a supporting part that interconnects the two surfaces. The design allows for effective stress management in electronic applications.
Another notable patent is the "Interconnect structure of an integrated circuit and manufacturing method thereof." This patent relates to a flexible packaging interconnect structure that includes conductive pads and tiny conductive pillars. The unique arrangement of these pillars enhances contact strength, allowing for reliable connections with fibers made of conductive materials. This innovation ensures high reliability without the need for thermosetting polymers.
Career Highlights
Yung-Yu Hsu is affiliated with the Industrial Technology Research Institute, where he continues to push the boundaries of technology in electronic interconnects. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.
Collaborations
He has collaborated with notable coworkers such as Shyi-Ching Liau and Ra-Min Tain, contributing to various projects that enhance the field of electronic engineering.
Conclusion
Yung-Yu Hsu's innovative patents and contributions to interconnect structures highlight his role as a key figure in the advancement of electronic technology. His work not only improves the functionality of electronic devices but also paves the way for future innovations in the industry.