The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
May. 22, 2006
Yung-yu Hsu, Hsinchu, TW;
Kuo-ning Chiang, Yangmei Township, Taoyuan County, TW;
Chang-an Yuan, Kaohsiung, TW;
Chang-chun Lee, Longtan Township, Taoyuan County, TW;
Hsien-chie Cheng, Hsinchu, TW;
Yung-Yu Hsu, Hsinchu, TW;
Kuo-Ning Chiang, Yangmei Township, Taoyuan County, TW;
Chang-An Yuan, Kaohsiung, TW;
Chang-Chun Lee, Longtan Township, Taoyuan County, TW;
Hsien-Chie Cheng, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an active component and a passive component is attached to the flexible substrate by adhesion. In the flexible substrate, electric signals of the electronic device are delivered to the pin terminal through at least a conductive wire for transmitting electric signals. In assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate. Then, the flexible substrate is folded so as to package the electronic device in a three-dimensional multichip stack manner.